3M Ukutyhila iSemiconductor Chip Adhesive Solutions

Dec 31, 2025

Shiya umyalezo

I-3M yokutyhila i-Semiconductor Chip Adhesive Solutions

Igqanyisiwe kwiSemiconductor ka-2026 (3rd), iSensor & Emerging High{2}}Ekupheleni iForam ye-Electronics adhesive Innovation

Njenge-semiconductor yase-China, isivamvo, kunye nemizi-mveliso ephumayo ephezulu-yemveliso ye-elektroniki iqhubeleka ukuya ngakwicala.ukudityaniswa okuphezulu, i-miniaturization, kunye nokuxinana kwentsebenzo, izinto zokuncamathelisa ziye zaba yinto ebalulekileyo ekuveliseni i-elektroniki ephezulu. Ukusukaindibano yetshiphu kunye nokuncipha kulawulo lwe-thermal, izisombululo zokudibanisa ngoku zidlala indima eqinisekileyo ekuthembekeni kwemveliso, isivuno, kunye{0}}nozinzo lwexesha elide.

Ngokuchasene nale meko, i2026 (3rd) iSemiconductor, iSemiconductor, iSemiconductor, iSensor & Emerging High{2}}Isiphelo seForam yokuQinisekisa ngokuQinisekisayo kwi-Electronicsiya kubanjwaNgoJanuwari 7–8, 2026, eShenzhen, eTshayina. Iforamu iququzelelwa ngokudibeneyo nguSTK Tape, iUmanyano olutsha loShishino lweZixhobo, kwaye iShenzhen Intelligent Sensor Industry Association, phakathi kwabanye.

Ukwakha kuhlelo oluyimpumelelo olubanjwe ngo-2023 nango-2024, iqonga lalo nyaka lijolise ekunikezeleni{0}ulwazi olunzulu kwiintsingiselo zemarike, imingeni yesicelo, kunye nokuphumelela kobuchwepheshekwimathiriyeli encamathelayo ye-elektroniki ephezulu{{0}ephezulu, exhasa uphuhliso oluphezulu-lomgangatho ophezulu we-ecosystem ye-elektroniki yaseTshayina.


Inkokeli yeGlobal Adhesive 3M ukunikezela ngeNgcaciso-ntetho ePhambili

"Izisombululo ze-3M ezincamathelayo kwiiChips zeSemiconductor"

Abaququzeleli beforam baneluwo ukwamkela3M China Co., Ltd., inkokeli yehlabathi kwi-adhesive and functional material technologies, njengomthathi-nxaxheba ophambili kweso siganeko.

UGqr. Liu Wei,
UMphathi oPhezulu woPhuhliso lweMarike, i-Greater China, i-3M yaseChina,
umenyiwe ukuba enze intetho yobugcisa enesihloko:

"Izisombululo ze-3M ezincamathelayo kwiiChips zeSemiconductor"


Inkangeleko yeSithethi|UGqr. Liu Wei

Iminyaka eyi-19 yamava kwi-3M

UMphathi oPhezulu woPhuhliso lweMarike, i-Greater China (iminyaka eyi-6)

Ingcaphephe yeTeyiphu ephezulu kunye neTekhnoloji yokuncamathelisa yaseAsia -Pacific (iminyaka eyi-14)

Amava abanzi kwiuphuhliso lwemveliso, uphuhliso lwenkqubo,-ukunyusa imveliso, kunye nobunjineli besicelo

UGqr. Liu waziwa ngokubanzi ngokukwazi kwakhe ukuchongaiindlela ezivelayo kwimarike yombanekwaye uguqulele itekhnoloji yemathiriyeli ephezuluezisebenzayo, inkqubo{0}}izisombululo zokudibanisa kwinqanabangaphaya kwekhonkco lexabiso lokudityaniswa kwe-elektroniki. Uqhubeka edibanisa uphuculo lwamva nje lobuchwephesha kwizicwangciso ezincamathelayo ezisebenzayo zesemiconductor kunye{1}}nosetyenziso oluphezulu lwe-elektroniki.


Imixholo engundoqo yeNtetho-ntetho

Unikezelo lukaGqr. Liu luza kugxila kubuchwephesha bokuncamathelisa obuxhasa ukupakishwa kwesemiconductor ephezulu kunye{1}}nokusebenza okuphezulu kosetyenziso lwekhompuyutha, kuquka:

I-Adhesives ye-Semiconductor Chip Assembly

Imiceli mngeni engundoqo yonxulumano kwitshiphu, iwafa, kunye nephakheji{0}}indibano yenqanaba

{0}}Ukuthembeka okuphezulu kwezisombululo zokuncamathelisa ukuchaneka kwemveliso yombane

I-Adhesives ye-Chip Thinning kunye neeNkqubo zeThutyana zoBonding

Izisombululo zezinto eziphathekayo zokunciphisa, ukulungiswa, kunye neenkqubo zokudibanisa

Ukuphucula isivuno kunye nokuzinza kwenkqubo kwimveliso ye-semiconductor ephezulu

Izisombululo ezincamathelayo zoLawulo lwe-Thermal kwi-High{0}}Iitshiphu zokuSebenza

Izinto ezincamathelayo kunye nokudityaniswa kwe-AI kunye -necomputing ephezulu{1}itshiphu zamandla

Ukulinganisa i-thermal conductivity ephezulu, uxinzelelo oluphantsi, kunye{0}}nokuthembeka kwexesha elide


Malunga ne-3M yaseTshayina

Yasekwa kwi1984, 3M China Co., Ltd.yenye yeenkampani ezimbalwa kwihlabathi jikelele ezikwaziyo ukubonelelaizisombululo ezidibeneyo ezigquma iiteyiphu, izinto zokuncamathelisa, kunye neenkqubo zokuzincamathela ezizihambelayo.

Ubukho be-3M eTshayina bubandakanya:

Iindawo ezili-9 zokuvelisa

Iiofisi zamasebe ezingama-20

Amaziko ama-4 obugcisa kunye neziko le-R&D eli-1

Phantse8,000 abasebenzi

Yasekwa kwiNgowe-1902 eUnited States, I-3M yinkampani yetekhnoloji eyohlukeneyo yehlabathi kunye nebhentshi kubuchule bokwenza izinto ezintsha.

FY2024 ingeniso yehlabathi:I-USD 24.575 yezigidigidi

FY2024 intsalela yenzuzo:I-USD 4.009 yezigidigidi

Jan–Sep 2025 ukusebenza:

Ingeniso: RMB 18.815 billion

Inzuzo eseleyo: USD 2.673 billion


Ukujongana nemingeni yoShishino kunye nokuBumba iKamva lezinto ezincamathelayo zoMbane

Iforamu ka-2026 iya kujongana ngqo naleiimfuno zemarike zamva nje kunye nemingeni yobugcisakwisemiconductor, isivamvo, iirobhothi, kunye nezinye eziphuma phezulu{0}}usetyenziso lwe-elektroniki oluphezulu. Iza kugxininisa kwiiintlungu eziphambili, amathuba okutsha, kunye neemeko zokusetyenziswaukuba iinkampani zezinto ezincamathelayo zikhathalele kakhulu.

Njengomboneleli wesisombululo seteyiphu encamathelayo esebenza nge-elektroniki kunye nabathengi bemizi-mveliso kwihlabathi liphela,STK Tapeiyaqhubeka ilandelela ngokusondeleyo iinkokheli zobuchwepheshe zehlabathi ezifana ne-3M. Ngokuguqulela ukusika{2}}izinto ezintsha ezintsha kwiusetyenziso, {0}izisombululo zebhondi eqhutywayo, i-STK Tape izibophelele ekuxhaseni isizukulwana esilandelayo-sokwenziwa kwemveliso yombane ephezulu.

Iinkcukacha zoMnyhadala
�� Umhla:NgoJanuwari 7–8, 2026
�� Indawo:eShenzhen, eTshayina
�� Isiganeko:2026 (3rd) iSemiconductor, iSemiconductor, iSemiconductor, iSensor & Emerging High{2}}Isiphelo seForam yokuQinisekisa ngokuQinisekisayo kwi-Electronics

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