Die -} Iteyiphu iswiti yinto encedisayo kwi-elektroniki, inqwelo moya, kunye nokupakisha amashishini. Ukuzinza kwayo kwentsebenzo Impembelelo kwimpembelelo yemveliso. Ukugcina okungafanelekanga kunokukhokelela ngokulula kwiingxaki ezinjengokuguga, ukuhla kwehle, okanye ukuthotyelwa kwendawo. Ulawulo lokugcina isayensi lubalulekile ekuqinisekiseni ukusebenza kwalo.
Environmental control is fundamental. Die-cut tape should be stored in a constant temperature and humidity environment with a temperature of 10-30°C and a relative humidity of 40%-60%. High temperatures (>I-35 degree) ikhawuleze i-oxidation ye-oxidation, ekhokelela ekuphulukaneni nonamathembululo; amaqondo obushushu asezantsi (<5°C) can make the substrate brittle and increase the risk of delamination. Excessive humidity can cause moisture absorption in the adhesive layer, impairing lamination; excessive dryness can cause the substrate to shrink and deform. Temperature and humidity monitoring equipment is recommended to avoid extreme conditions.
Amanyathelo ogcino ahleliweyo kunye nokukhusela kubaluleke kakhulu. Iiteyiphu zezinto ezahlukeneyo (ezinje ngesilwanyana, i-foam, kunye ne-{1} {{1} {{1} {{2}) kufuneka igcinwe ngokwahlukeneyo ukuthintela umnqamlezo. I-rolls engafakwanga yeteyipu kufuneka igcinwe itywinwe kwiphakeji yabo yokuqala ukuthintela uthuli. Die {{}}} ityhubhu kufuneka igcinwe igcinwe i-fursure {{6}-} i-felets ezinobungqina. Kunqande ukusongela okanye ukuyifaka kwizinto ezinzima ukuthintela ukubambelela okanye ukuqhekeza ungqimba olunamathela okanye ukuxhaswa.
Eyokuqala - kwi - kuqala - -}} Sebenzisa ngoMhla weMveliso ukuze unciphise imijikelezo yempahla. Ngokubanzi, ubomi beshelfu ye-die - ukusika itayiphu ziinyanga ezi-6 ukuya kwezi-12 (kuxhomekeka kumgaqo womvelisi). Iteyiphu ephelelwe lixesha kufuneka iphinde iphinde iphinde ihlawulwe i-adhesion kunye nenkangeleko ngaphambi kokuyisebenzisa.
Ngolawulo olungqongqo olungqongqo, ukhuseleko oluhlelweyo, kunye nolawulo lweempahla, sinokwandisa uzinzo lwentsebenzo yokufa
